USA jobs: Electronics Designer

Great opportunity for an ELECTRONIC DESIGN ENGINEER with the skills to develop layout of electrical circuits that can fit into small space envelopes for high volume, high yield electronic assembly production lines.

Responsibilities

* Responsible for the design and direction of electrical circuit layouts for sensing applications with the goal of turning the layouts into manufacturable product
* Responsible to develop robust layouts that can fit into small space envelopes required by sensing applications and then can be produced with extremely high yields on high volume production lines

Requirements

* Requires BS Technical, MS is a plus, with strong materials background and experience with electronic product Design for Manufacturability
* Must have general knowledge of manufacturing and knowledge of circuit layout from schematic capture to finished circuit layout
* Requires skills with chip and wire assembly techniques, micro joining techniques, plating techniques, SMT,Pb free soldering, traditional laminate based PCB’s, thick film ceramic substitutes, encapsulation methods, packaging techniques for bulk micro-machined based MEMs devices, flipchip assembly methods, analytical techniques available to assess packaging, DOE, statistical process control, elements of an AIAG PPAP
* Proficiency with AutoCAD, Solid Works is preferred. Familiarity with circuit layout tools like Mentor Graphics is a plus

Benefits

* Full Company Benefits
* Relocation is available



Questions you will be asked:

• Please detail your Electronic Module Assembly ability to design and direct electrical circuit layouts for sensing applications with the goal of turning the layouts into manufacturable sensor products in a high volume, high yield manufacturing environment.

• List your education and rate your skills with AutoCAD, Solid Works and circuit layout tools like Mentor Graphics.

• Rate your knowledge of chip and wire assembly techniques, micro joining techniques, plating techniques, SMT,Pb free soldering, traditional laminate based PCB’s, thick film ceramic substitutes, encapsulation methods, packaging techniques for bulk micro-machined based MEMs devices, flipchip assembly methods, analytical techniques available to assess packaging, DOE, statistical process control, and elements of an AIAG PPAP.

• Are you willing to relocate to Massachusetts? Where are you currently located? When are you available?


To APPLY go to:

http://jobview.boston.monster.com/Electronics-Designer-Job-Attleboro-MA-US-101712236.aspx