Senior Microelectronics Assembly Technician

Position Description:

Group 83—Electro-Optical Materials and DevicesThe Electro-Optical Materials and Devices Group develops compound semiconductor materials and devices. This group also develops and applies photonic components including semiconductor lasers, amplifiers, and detectors for enhancing the capabilities of DoD systems. The Electro-Optical Materials and Devices Group develops advanced optoelectronic components and subsystems for DoD and NASA applications. An individual is needed to perform microelectronic assembly of advanced optoelectronic components such as lasers and detectors with integrated lenslet arrays. Operates highly technical experimental apparatus. May direct and train technicians of lower grade. Has understanding of the theoretical aspects of the experiments. Has demonstrated outstanding skill and performance in the particular field of activity. Requires little or no supervision.Graduation from a two year day technical school or itsequivalent and a minimum of five years of applicable experience are required. Senior-level micro-electronics technician capable of the independent manufacture of prototype optoelectronic packaging in a cleanroom environment. Demonstrated hands-on experience in the assembly of microelectronics packaging. Adept skill using tweezers and probing instruments under high magnification; experience in the cleaning and handling of delicate optoelectronic components. Familiarity with plating systems commonly used for microelectronics components and the solvents, acids, and chemicals used to prepare and clean components. Familiarity with critical inspection of devices and the disposition of non-conforming material. Specific skill areas in the following technologies: component solder attach using preforms, fluxes, and pastes; adhesive technology; precision optical assembly; contamination control; hermetic sealing; solder reflow systems; wire bonding. Familiarity with optical alignment, vacuum systems and thin film deposition processes of metals and oxides, along with experience cleaving and dicing of semiconductor materials would be desirable.