Semiconductor Process Engineer

This position will support the 3D Microsystem Integration program area including 3D electronics, advanced packaging and MEMS fabrication. 

Primary duties and responsibilities will include:
• Fabrication process development and lot management/engineering. 
• Photolithographic processing
• Wet processing
• Dry etching
• Electroplating. 

The position will also support the execution of integrated process runs and critical inspection.  The successful candidate will have a strong background in back-end-of-the-line (BEOL) semiconductor processing.  Experience in MEMS processing and electronic packaging is also desired.

Qualifications:
• B.A., B.S., or M.S. or equivalent degree in a physical science or engineering
• 1-5 years of job experience
• Experience with device fabrication processes.
• The successful candidate will have good hands-on laboratory skills, good verbal and written communication skills, and be able to work independently as well as within a group setting.
• US Citizenship or permanent resident alien status is required.