Semiconductor Packaging Engineer / OPS2027

Position Description:There is an immediate need for a Packaging Staff Engineer to work out of our Irvine facility. Skyworks designs, develops, and packages premier semiconductor solutions for the RF and wireless markets. The company utilizes leading edge packaging technology to achieve maximum RF performance, and superior quality/reliability at a competitive cost. Current packages include MCM, LGA, BGA, QFN and WLCSP form factors. We are currently seeking a senior engineering candidate in advanced package development. Candidate will be responsible for developing innovative, leading edge packaging technology and processes while meeting defined objectives for cost, reliability, and manufacturability. Heavy cross-functional interaction with a sizeable team across numerous Skyworks’ facilities and suppliers will be necessary to achieve the stated objectives. Role requires the development and validation of advanced packaging technology, including defining and validating processes, materials, equipment and costs. Will define and execute process DOEs, monitor reliability testing and overall qualification and subsequent production ramps. Position is “hands on� in nature and requires close involvement though all levels of the program. Candidate will rely upon project management skills to keep multiple activities within the scope and schedule of the overall program objectives.Qualifications:Requirements for this position include but are not limited to the following: • BS Mat. Science, Mechanical, Chemical, or Package Engineering. MS preferred. 3 to 5 years minimum experience in semiconductor packaging and product development• Experience with developing and producing traditional packaging technologies such as wafer processing, die attach, wire bond, flip chip, encapsulation, mold, printed circuit boards/leadframes required. Experience with wafer level packaging a plus. Working knowledge of semiconductor fabrication expected. Experience with flip chip assemblies and/or a working knowledge of SMT and related package design rules and materials a strong plus. Experience with transitioning technology development to high volume manufacturing and sustaining process yields.• Strong understanding of SPC techniques, FMEAs, Six Sigma, and Reliability Standards. Excellent communication skills - verbal, written and presentation. Strong driver who is assertive and results/goal oriented. Team player with good interpersonal skills, and able to work efficiently with a multi-functional group and with suppliers. Regular travel required. Ref Code: 2027Learn more about "Skyworks Solutions, Inc." Skyworks offers all the advantages you would expect from an industry leader. Skyworks is an equal opportunity employer supporting diversity in the workplace.