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Home Electronics, Components, and Semiconductor Mfg SSI-Package-Design-Principal-Engineer


 SSI_Package Design, Principal Engineer

Details
Country: USA
Location: California-Silicon Valley/San Jose San Jose, CA 95134
Total applied: 40
Job Category:Engineering
Location:CA 95134
Status:Full Time, Employee
Occupations:Electrical/Electronics Engineering
Career Level:Manager (Manager/Supervisor of Staff)
SSI_Package Design, Principal Engineer

Position Summary
We seek a highly experienced package specialist with broad knowledge and experience in package design, extraction, modeling, analysis, and power and signal integrity. This position will be a key interface between our San Jose SoC development team and package development teams in Korea. Common Essential Duties & Resp.
The main responsibilities are in the following areas- Development of high performance small form factor packages such as PoP, SiP and flipchip packages- Extensive interactions with customers' package, board and chip design teams to accurately understand customer requirements- Extensive collaboration and co-design with package development and technology teams in Korea to ensure high quality package design with minimal turn around time- Drive the advancement of internal package design, extraction, modeling, analysis and power and signal integrity techniques and methodologies- Frequent travel to Samsung headquarters in KoreaBackground/Experience
Major responsibilities of this position include:- Solid experience with package design including advanced high-speed small size packages such as PoP, SiP, and/or flipchip- Solid understanding of good package design, modeling, and analysis principles and practices- Familiarity with package design tools (ex. Cadence's Allegro Package designer)- Experience to manage and perform package design including device, and set board, independently- Ability to communicate effectively both in person and with remote teams- Strong attention to detail and pride in one's work- Experience with electrical characterization of package especially for mobile applications is required- Experience in the area of high-speed, low-power, and high-density package is a strong plus- Experience with electrical simulation tools (such as TPA, PowerSI, Hspice etc) is a plus- Lab experience using TDR and VNA is a plus- Ability to work in multi-location and international team environment- 10+ years of direct experience- BSEE required, MSEE/PhD preferred
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