Package Design Engineer

Inphi is a fast-growing, pre-IPO, fabless semiconductor company based in Westlake Village, CA and Sunnyvale, CA. The company was founded in 2001 and has developed the industry-leading product line of server logic ICs in production at all Tier 1 suppliers.  Inphi is recognized as the world leader in the development of highest performance analog ICs.  The successful candidate will have the opportunity to work on demanding technical challenges with the most outstanding group of collaborators in the industry.  Inphi won the Most Respected Private Fabless Company Award in 2007 from the Global Semiconductor Alliance (GSA).Inphi is seeking an experienced Package Design Engineer for its fast growing line of products for telecom, datacom, computing and test and measurement applications.  The successful candidate will join the high potential pre-IPO company, and work at Inphi headquarters in Westlake Village, CA, and report to the Director of Central Engineering.

Responsibilities: Interface with IC designers and marketing teams to define package requirements from electrical, thermal, and mechanical point of view; Make recommendations on package architecture, and technology and material, to implement package solutions within time and budget; Interface with package supplier to drive layout, ensure manufacturability, and meet requirements; Develop accurate and stable package models for IC-package co-design; Interface with IC designers to correctly implement models for SSO and power delivery network anaylsis Design different and challenging packages for Inphi's line of products Take the initiative to improve package design methodology and its integration in IC design flow; and Work with Operations to ensure manufacturability of product designs.

Qualifications: Master's degree in Electrical Engineering or 5+ years of industry experience with design of packages for high speed analog / mixed-signal ICs; Strong fundamentals of transmission lines, EM, and microwave theory;  Experience designing and simulating power delivery networks for digital and analog ICs; Experience in designing for manufacturability;  Knowledge of packaging technologies, materials, package substrate design rules and assembly rules; Experience with VNA and TDR measurements for package characterization; Experience with measurements and/or simulation-based model extraction; Strong communication and documentation skills Proven track record of package development from concept to production. Strong working knowledge of EM simulation tools: HFSS, IE3D, SI-Wave, Momentum; Working knowledge of circuit design tools: Spectre and ADS; Familiarity with layout and CAD tools (APD, PADS, AutoCAD); Layout experience (APD, PADS) is a big plus; and Strong communication and presentation skills.