PROCESS ENGR II

Company Name: TYCO ELECTRONICS Location: LOWELL   Job Category: Engineering Career Level: Experienced (Non-Manager) Job Description   Tyco Electronics is an industry powerhouse with an entrepreneurial spirit, fueled by innovation and collaboration. We are a $13.5 billion global provider of engineered electronic components, network solutions and wireless systems for industries ranging from automotive, appliances and aerospace to computers, consumer electronics and telecommunications.   Our nearly 100,000 dedicated employees around the globe remain steadfast in their commitment to serving customers in more than 150 countries. This is your chance to make an impact in a supportive atmosphere full of inspiration, integrity and empowerment.   Come turn our opportunities into your advantage at Tyco Electronics. To apply, scroll back up and click on the link to Apply Now! Manufacturing/Process engineer with semiconductor and hybrid packaging/assembly experience. Experience in development, troubleshooting and qualification of processes such as eutectic die attach, epoxy die attach, wire bonding, liquid encapsulation, sealing, marking, solder sphere attach/SMT re-flow and saw singulation (dicing) is desired. Position requires interaction with design and product engineers in applying engineering principals to solve a range of difficult problems requiring imaginative and practical solutions as well as transitioning/converting new products to production. Position requires interaction with other manufacturing engineers, sub-contract manufacturers, quality engineering, production personnel and equipment maintenance personnel to resolve material quality, equipment, documentation and process issues. Support production in process control, yield improvement, new process qualification, assembly procedure generation and failure analysis. A B.S. degree is required.   Knowledge of Statistical Process Control, Design of Experiments, Process Improvement Methodology and Lean Manufacturing Principals. Microsoft Word, Excel, Powerpoint. Experience with Hybrid Module Assembly, Multi-chip Modules, BGA, SMT and Ceramic packaging/assembly is desirable. Limited travel may be required.   If interested, please apply online at http://track.jobviper.com/ViewJob.asp?id=565673-3-733 Contact Information     Click here to see all “Tyco Electronicsâ€� opportunities Visit our web site to learn more about Tyco Electronics EMAIL THIS JOB TO A FRIEND